HomeCompanyProductQualityContact UsEnDe
 
   
 
 
Product
Capability

Product

Conventional PCBs
Layer count up to 36layer;
Trace width/space down to 3mil;
Aspect Ratio: 20:1;
Hybrid construction;
RF and Microwave circuits;
Heavy copper up to 10oz;
Thick gold up to 80u";
Embbeded coin or metal core MLB;
Machenical drill size: 6mil;
Rigid Flex PCBs
Layer count up to:16/8layer(Rigid/Flex);
Trace width/space down to 3mil;
Aspect Ratio: 15:1;
Machenical drill size: 6mil;
HDI PCBs
Laser drill step:4+C+4;
Any layer connection for 12layer max.;
Trace width/space down to 3mil;
Pad size of via-in-pad:8mil min.;
Laser drill size:4mil min.
IC Substrate
CSP (Chip Scale Packages):16layer;
FC-CSP (Flip Chip) CSP:16layer;
BOC (Board on Chip):12layer;
FC-BOC (Flip Chip) BOC:12layer;
SiP (System in Package):16layer;
PBGA:16layer;
 
 
     
   
 

Startseite

Vorteile

HUASUN © 2016 | Copyright

Impressum
AGB
Datenschutz
Kontakt
www.huasuncorp.com

Unsere Profession ist die PCB Produktion
WIR bieten Ihnen „high quality“ professionell produzierte PCBs.
WIR produzieren nach EUROPÄISCHEN STANDARDS.
WIR sind nach EN ISO 14001-2004 STANDARDS zertifiziert.

info@huasuncorp.com
www.huasuncorp.com