Conventional PCBs
Layer count up to 36layer;
Trace width/space down to 3mil;
Aspect Ratio: 20:1;
Hybrid construction;
RF and Microwave circuits;
Heavy copper up to 10oz;
Thick gold up to 80u";
Embbeded coin or metal core MLB;
Machenical drill size: 6mil; |
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Rigid Flex PCBs
Layer count up to:16/8layer(Rigid/Flex);
Trace width/space down to 3mil;
Aspect Ratio: 15:1;
Machenical drill size: 6mil; |
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HDI PCBs
Laser drill step:4+C+4;
Any layer connection for 12layer max.;
Trace width/space down to 3mil;
Pad size of via-in-pad:8mil min.;
Laser drill size:4mil min. |
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IC Substrate
CSP (Chip Scale Packages):16layer;
FC-CSP (Flip Chip) CSP:16layer;
BOC (Board on Chip):12layer;
FC-BOC (Flip Chip) BOC:12layer;
SiP (System in Package):16layer;
PBGA:16layer; |
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